MR18R326GAG0-CM8 FOLHA DE DADOS,CIRCUITO,A FUNÇÃO

MR18R326GAG0-CM8 Datasheet PDF

Fabricante	Packing	Descrição	PDF	Temperatura
SAMSUNG[Samsung semiconductor]		(32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V	MR18R326GAG0-CM8 PDF	Min°C \| Max°C

SAMSUNG[Samsung semiconductor] MR18R326GAG0
(32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V
SAMSUNG[Samsung semiconductor] MR18R326GAG0-CM8
(32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V
SAMSUNG[Samsung semiconductor] MR18R326GAG0-CT9
(32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V